Find The Best Chinese Factory
China Green Solder Mask Prototype High Density Interconnect HDI PCB High TG Material

Green Solder Mask Prototype High Density Interconnect HDI PCB High TG Material

MOQ： 1
Price： Negotiable
Get Best Price Contact Us
PRODUCT DESCRIPTION
Payment Terms T/T, Western Union, L/C
Supply Ability 300, 000 sqm Per Month
Delivery Time 5-8 working days
Packaging Details INNER VACCUM-PACKED WITH OUTER CARDBOARD CARTON
View More
ABOUT US
China factory - Foisontech Corporation Co., Limited
Foisontech Corporation Co., Limited
Guangdong , China
5.0
Active Member
View More
GET THE BEST PRICE FOR
China Green Solder Mask Prototype High Density Interconnect HDI PCB High TG Material
Green Solder Mask Prototype High Density Interconnect HDI PCB High TG Material
MOQ： 1
Price： Negotiable
Continue
RECOMMENDED PRODUCTS
China HDI PCB Board 10 Layer BGA High Density Interconnect PCB Immersion Gold Plated

HDI PCB Board 10 Layer BGA High Density Interconnect PCB Immersion Gold Plated

 Foisontech Corporation Co., Limited Send Inquiry
China 6-Layer HDI mobile phone PCB layout OSP Surface Finishing Board

6-Layer HDI mobile phone PCB layout OSP Surface Finishing Board

 Foisontech Corporation Co., Limited Send Inquiry
China HDI Multilayered PCB 6-Layer Board, GPS PCB Board & GPS Board Assembly, 18um

HDI Multilayered PCB 6-Layer Board, GPS PCB Board & GPS Board Assembly, 18um

 Foisontech Corporation Co., Limited Send Inquiry
ABOUT US
China factory - Foisontech Corporation Co., Limited
Foisontech Corporation Co., Limited
Guangdong , China
5.0
Active Member
Company Name Foisontech Corporation Co., Limited
Business Type Manufacturer
Brands FOISON
Employee Number 200~300
Year Established 2005
Total Sales Annual 2000,000-3000,000
Company Location 3rd Building,Xinwuyuan Industrial Park, Difu Road,Gushu,Xixiang,Bao'an District,Shenzhen,China.
Factory Location Shangxing West Industrial Zone,1001 Xihuan Road,Shajing Street,Bao'an District,Shenzhen,China.
Get Latest Price for your requirement
PRODUCT DESCRIPTION