China RoHS UL HDI High Tg Buried And Blind Via Holes Multi Layer PCB China RoHS UL HDI High Tg Buried And Blind Via Holes Multi Layer PCB China RoHS UL HDI High Tg Buried And Blind Via Holes Multi Layer PCB

RoHS UL HDI High Tg Buried And Blind Via Holes Multi Layer PCB

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PRODUCT DESCRIPTION
Board thickness 0.2-3.0mm
Copper thickness 1/2OZ 1OZ 2OZ 3OZ
Base material FR-4,FR-4/aluminum/ceramic/cem-3/FR-1
Min. line spacing 0.1mm4mil),0.2mm
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China factory - Abis Circuits Co., Ltd.
Abis Circuits Co., Ltd.
Guangdong , China
5.0
Active Member
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China RoHS UL HDI High Tg Buried And Blind Via Holes Multi Layer PCB
RoHS UL HDI High Tg Buried And Blind Via Holes Multi Layer PCB
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ABOUT US
China factory - Abis Circuits Co., Ltd.
Abis Circuits Co., Ltd.
Guangdong , China
5.0
Active Member
Company Name Abis Circuits Co., Ltd.
Business Type Manufacturer,Exporter
Brands ABIS
Employee Number 200~1200
Year Established 2006
Total Sales Annual 88-102Million
Company Location 4113-4116# A Area, HSST PARK, BAO'AN District, Shenzhen, China
Factory Location 9 Builing 3 Floor Lisheng Park QiaoTangRd, TangWei Fuyong Town, Shenzhen China.
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PRODUCT DESCRIPTION