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China 4 Layer PCB Hdi Printed Circuit Boards With Blind Buried Half Holes OSP+ENIG China 4 Layer PCB Hdi Printed Circuit Boards With Blind Buried Half Holes OSP+ENIG China 4 Layer PCB Hdi Printed Circuit Boards With Blind Buried Half Holes OSP+ENIG China 4 Layer PCB Hdi Printed Circuit Boards With Blind Buried Half Holes OSP+ENIG China 4 Layer PCB Hdi Printed Circuit Boards With Blind Buried Half Holes OSP+ENIG China 4 Layer PCB Hdi Printed Circuit Boards With Blind Buried Half Holes OSP+ENIG

4 Layer PCB Hdi Printed Circuit Boards With Blind Buried Half Holes OSP+ENIG

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PRODUCT DESCRIPTION
Payment Terms T/T
Supply Ability 1kkpcs/month
Delivery Time 25 work days
Packaging Details 400pcs/bag, 20bags/carton
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China factory - Witgain Technology Ltd
Witgain Technology Ltd
Guangdong , China
5.0
Active Member
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China 4 Layer PCB Hdi Printed Circuit Boards With Blind Buried Half Holes OSP+ENIG
4 Layer PCB Hdi Printed Circuit Boards With Blind Buried Half Holes OSP+ENIG
MOQ： negotiable
Price： Negotiable
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ABOUT US
China factory - Witgain Technology Ltd
Witgain Technology Ltd
Guangdong , China
5.0
Active Member
Company Name Witgain Technology Ltd
Business Type Manufacturer
Employee Number 300~350
Year Established 2007
Total Sales Annual 20000000-25000000
Company Location Block 11, International E-Commerce Logistic Center, PingHu Street, LongGang Distric, ShenZhen City
Factory Location Factory 1: ShiZhi Industrial Park, DAYAWAN Area , HuiZhou City, GuangDong Province , China Factory 2: WeiBang Road, XinFeng County, JiangXi Province
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PRODUCT DESCRIPTION