China Multi Layer Bluetooth PCB Board FR4 Hight TG ENIG HASL-LF OSP For Headphones China Multi Layer Bluetooth PCB Board FR4 Hight TG ENIG HASL-LF OSP For Headphones China Multi Layer Bluetooth PCB Board FR4 Hight TG ENIG HASL-LF OSP For Headphones China Multi Layer Bluetooth PCB Board FR4 Hight TG ENIG HASL-LF OSP For Headphones

Multi Layer Bluetooth PCB Board FR4 Hight TG ENIG HASL-LF OSP For Headphones

MOQ: 1pcs
Price: Negotiate(according to PCB Gerber file)
PRODUCT DESCRIPTION
Payment Terms L/C, D/A, D/P, T/T
Supply Ability 100000pcs
Delivery Time 1-30days
Packaging Details PCB: Vacuum Packing / PCBA: ESD Packing/carton box
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China factory - Shenzhen Senyan Circuit Co., Ltd.
Shenzhen Senyan Circuit Co., Ltd.
Guangdong , China
5.0
Active Member
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China Multi Layer Bluetooth PCB Board FR4 Hight TG ENIG HASL-LF OSP For Headphones
Multi Layer Bluetooth PCB Board FR4 Hight TG ENIG HASL-LF OSP For Headphones
MOQ: 1pcs
Price: Negotiate(according to PCB Gerber file)
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ABOUT US
China factory - Shenzhen Senyan Circuit Co., Ltd.
Shenzhen Senyan Circuit Co., Ltd.
Guangdong , China
5.0
Active Member
Company Name Shenzhen Senyan Circuit Co., Ltd.
Business Type Manufacturer,Distributor/Wholesaler,Exporter,Other
Brands SenYan
Employee Number >100
Year Established 2017
Total Sales Annual >1000000
Company Location E602/609,Huafeng creative world, Hangcheng Industrial Park, Xixiang, Baoan Dist., 518100,Shenzhen City, Guangdong Province, China.
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PRODUCT DESCRIPTION