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China High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder China High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder

High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder

MOQ： ≥1 pc
Price： Negotiable
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PRODUCT DESCRIPTION
Payment Terms T/T,
Delivery Time 25~50 days
Packaging Details Plywood crate
Name IC Bonder
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ABOUT US
China factory - Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd
Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd
Guangdong , China
5.0
Verified Supplier
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China High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder
High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder
MOQ： ≥1 pc
Price： Negotiable
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ABOUT US
China factory - Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd
Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd
Guangdong , China
5.0
Verified Supplier
Company Name Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd
Business Type Manufacturer
Brands SUNEAST
Employee Number 300~500
Year Established 1984
Total Sales Annual 30000000-45000000
Company Location Suneast Ind.Park, No.13, Yongping 2nd Rd., Fuyong Street, Bao'an District, Shenzhen city,Guangdong Prov., China
Factory Location Suneast Ind.Park, No.13, Yongping 2nd Rd., Fuyong Street, Bao'an District, Shenzhen city,Guangdong Prov., China
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PRODUCT DESCRIPTION