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China pink 3.0W/mK CPU Heatsink Cutting Thermal Conductive Foam Ultrasoft Compressible China pink 3.0W/mK CPU Heatsink Cutting Thermal Conductive Foam Ultrasoft Compressible China pink 3.0W/mK CPU Heatsink Cutting Thermal Conductive Foam Ultrasoft Compressible China pink 3.0W/mK CPU Heatsink Cutting Thermal Conductive Foam Ultrasoft Compressible

pink 3.0W/mK CPU Heatsink Cutting Thermal Conductive Foam Ultrasoft Compressible

MOQ： 1000pcs
Price： Negotiation
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PRODUCT DESCRIPTION
Supply Ability 100000pcs/day
Delivery Time 3-5 days
Packaging Details 1000pcs/bag
Tensile Strength 40 psi
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ABOUT US
China factory - Dongguan Ziitek Electronic Materials & Technology Ltd.
Dongguan Ziitek Electronic Materials & Technology Ltd.
Guangdong , China
5.0
Verified Supplier
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China pink 3.0W/mK CPU Heatsink Cutting Thermal Conductive Foam Ultrasoft Compressible
pink 3.0W/mK CPU Heatsink Cutting Thermal Conductive Foam Ultrasoft Compressible
MOQ： 1000pcs
Price： Negotiation
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ABOUT US
China factory - Dongguan Ziitek Electronic Materials & Technology Ltd.
Dongguan Ziitek Electronic Materials & Technology Ltd.
Guangdong , China
5.0
Verified Supplier
Company Name Dongguan Ziitek Electronic Materials & Technology Ltd.
Business Type Manufacturer
Brands ZIITEK
Employee Number 100~150
Year Established 2006
Total Sales Annual 100000-160000
Company Location Building B8, Industry District Ⅱ, Xicheng, Hengli Township, 523460 Dongguan City
Factory Location Building B8, Industry District Ⅱ, Xicheng, Hengli Township, 523460 Dongguan City
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PRODUCT DESCRIPTION