China Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulat China Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulat

Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulat

MOQ: 5kg
Price:
PRODUCT DESCRIPTION
Payment Terms T/T
Delivery Time 3-8 work days
Packaging Details 1kg/can
Products name Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulation
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China factory - Dongguan Ziitek Electronical Material and Technology Ltd.
Dongguan Ziitek Electronical Material and Technology Ltd.
Guangdong , China
5.0
Verified Supplier
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China Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulat
Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulat
MOQ: 5kg
Price:
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ABOUT US
China factory - Dongguan Ziitek Electronical Material and Technology Ltd.
Dongguan Ziitek Electronical Material and Technology Ltd.
Guangdong , China
5.0
Verified Supplier
Company Name Dongguan Ziitek Electronical Material and Technology Ltd.
Business Type Manufacturer,Seller
Brands Thermazig
Employee Number 100~150
Year Established 2006
Total Sales Annual 1000000-16000000
Company Location Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City, 523460 Guangdong Province, China
Factory Location Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City, 523460 Guangdong Province, China
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PRODUCT DESCRIPTION