China Laser Direct Imaging PCB 50/75μM Outer Solder Bridge/Opening Process China Laser Direct Imaging PCB 50/75μM Outer Solder Bridge/Opening Process China Laser Direct Imaging PCB 50/75μM Outer Solder Bridge/Opening Process China Laser Direct Imaging PCB 50/75μM Outer Solder Bridge/Opening Process

Laser Direct Imaging PCB 50/75μM Outer Solder Bridge/Opening Process

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PRODUCT DESCRIPTION
Board thickness 0.5~3.5mm
Laser power Mixing Wave Total Power 512W
Solder bridge/solder opening 50/75μm(process Condition)
Alignment method PAD(diameter: 0.5~3.0mm)
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China factory - Jiangsu GIS Laser Technologies Inc.,
Jiangsu GIS Laser Technologies Inc.,
, China
5.0
Verified Supplier
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China Laser Direct Imaging PCB 50/75μM Outer Solder Bridge/Opening Process
Laser Direct Imaging PCB 50/75μM Outer Solder Bridge/Opening Process
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ABOUT US
China factory - Jiangsu GIS Laser Technologies Inc.,
Jiangsu GIS Laser Technologies Inc.,
, China
5.0
Verified Supplier
Company Name Jiangsu GIS Laser Technologies Inc.,
Business Type Manufacturer,Distributor/Wholesaler,Exporter,Other
Employee Number >100
Total Sales Annual >1000000
Company Location Floor 2, Building 2, Ruijing Building, No.868, Jinshan South Road, Mudu Town, Wuzhong District, Suzhou
Factory Location Floor 2, Building 2, Ruijing Building, No.868, Jinshan South Road, Mudu Town, Wuzhong District, Suzhou
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PRODUCT DESCRIPTION