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China Laser Direct Imaging PCB With Board Thickness 0.5~3.5mm For Outer Process China Laser Direct Imaging PCB With Board Thickness 0.5~3.5mm For Outer Process China Laser Direct Imaging PCB With Board Thickness 0.5~3.5mm For Outer Process China Laser Direct Imaging PCB With Board Thickness 0.5~3.5mm For Outer Process China Laser Direct Imaging PCB With Board Thickness 0.5~3.5mm For Outer Process

Laser Direct Imaging PCB With Board Thickness 0.5~3.5mm For Outer Process

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PRODUCT DESCRIPTION
Board thickness 0.5~3.5mm
Application PCB、HDI、FPC
Solder bridge/solder opening 50/75μm（process Condition）
Scale mode White, Black, Yellow, Etc.
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China factory - Jiangsu GIS Laser Technologies Inc.,
Jiangsu GIS Laser Technologies Inc.,
, China
5.0
Verified Supplier
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China Laser Direct Imaging PCB With Board Thickness 0.5~3.5mm For Outer Process
Laser Direct Imaging PCB With Board Thickness 0.5~3.5mm For Outer Process
MOQ：
Price：
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ABOUT US
China factory - Jiangsu GIS Laser Technologies Inc.,
Jiangsu GIS Laser Technologies Inc.,
, China
5.0
Verified Supplier
Company Name Jiangsu GIS Laser Technologies Inc.,
Business Type Manufacturer,Distributor/Wholesaler,Exporter,Other
Employee Number >100
Total Sales Annual >1000000
Company Location Floor 2, Building 2, Ruijing Building, No.868, Jinshan South Road, Mudu Town, Wuzhong District, Suzhou
Factory Location Floor 2, Building 2, Ruijing Building, No.868, Jinshan South Road, Mudu Town, Wuzhong District, Suzhou
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PRODUCT DESCRIPTION